• Processing Notes

Peak Reflow - 245°C

 

1.     Average ramp rate: 3°C per second maximum

2.     Preheat temperature (minimum): 150°C

3.     Preheat temperature (maximum): 200°C

4.     Preheat time: 60 to 120 seconds

5.     Ramp to peak: 3°C per second maximum

6.     Time over liquidus (217°C): 60 to 150 seconds

7.     Peak temperature: 245 +0/-5°C

8.     Time within 5°C of peak: 10 to 30 seconds

9.     Ramp - Cool Down: 6°C per second maximum
10.   Time 25°C to Peak: 8 minutes maximum


Suggested Wave Solder Processing:

RF coaxial connectors incorporating PTFE Insulators. Using Pb Free Solder.

 

Solder bath temperature shall be maintained at 265 ± 5/C.

Hold time in the solder 10 +2/-0 seconds.

 

Suggested Hand Solder Processing:

RF coaxial connectors incorporating PTFE Insulators. Using Pb Free Solder.

 

Iron temperature shall be maintained at 380 ± 5/C.
Dwell time 5 +2/-0 seconds.

 



Processing Notes

  • Cambridge Electronic Industries Ltd
  • Product Code: Processing Notes


Due to differences in processing equipment, consumables and applications, Cambridge Electronic Industries are unable to specify a recommended reflow profile for our products. Our reflow capable products are Pb free reflow compatible and can withstand a peak temperature of 260°C.

 

Weight and/or Centre of Gravity offsets associated with some of our connectors may lead to a requirement for mechanical constraint using Jigs, Fixtures or adhesives during processing.

 

Suggested Reflow Profile:

RF coaxial connectors incorporating PTFE Insulators. Using Pb Free Solder.

 


  • Processing Notes