Web Analytics
  • Processing Notes

Peak Reflow - 245°C

 

  1. Average ramp rate: 3°C per second maximum
  2. Preheat temperature (minimum): 150°C
  3. Preheat temperature (maximum): 200°C
  4. Preheat time: 60 to 120 seconds
  5. Ramp to peak: 3°C per second maximum
  6. Time over liquidus (217°C): 60 to 150 seconds
  7. Peak temperature: 245 +0/-5°C
  8. Time within 5°C of peak: 10 to 30 seconds
  9. Ramp - Cool Down: 6°C per second maximum
  10. Time 25°C to Peak: 8 minutes maximum


Peak Reflow - 260°C

  1. Average ramp rate: 3°C per second maximum
  2. Preheat temperature (minimum): 150°C
  3. Preheat temperature (maximum): 200°C
  4. Preheat time: 60 to 180 seconds
  5. Ramp to peak: 3°C per second maximum
  6. Time over liquidus (217°C): 60 to 150 seconds
  7. Peak temperature: 260 +0/-5°C
  8. Time within 5°C of peak: 20 to 40 seconds
  9. Ramp - Cool Down: 6°C per second maximum
  10. Time 25°C to Peak: 8 minutes maximum

Suggested Wave Solder Processing:

RF coaxial connectors incorporating PTFE Insulators. Using Pb Free Solder.

 

Solder bath temperature shall be maintained at 265 ± 5/C.

Hold time in the solder 10 +2/-0 seconds.

 

Suggested Hand Solder Processing:

RF coaxial connectors incorporating PTFE Insulators. Using Pb Free Solder.

 

Iron temperature shall be maintained at 380 ± 5/C.
Dwell time 5 +2/-0 seconds.


All Cambridge Electronics products are rated for moisture sensitivity level MSL-1, which means our products can be sorted for an unlimited time.

 


Processing Notes

  • Cambridge Electronic Industries Ltd
  • Product Code: Processing Notes


Due to differences in processing equipment, consumables and applications, Cambridge Electronic Industries are unable to specify a recommended reflow profile for our products. However, the following reflow profiles are suggested as guides. Our reflow capable products are Pb free reflow compatible and can withstand a peak temperature of 245°C / 260°C.

 

Weight and/or Centre of Gravity offsets associated with some of our connectors may lead to a requirement for mechanical constraint using Jigs, Fixtures or adhesives during processing.

 

Suggested Reflow Profile:

RF coaxial connectors incorporating PTFE Insulators. Using Pb Free Solder.

 


  • Processing Notes